India-Made Chips Reach Global Markets: Where the Semiconductor Mission Stands Now

Prime Minister Narendra Modi on Thursday inaugurated the fifth edition of Semicon India conference in New Delhi saying that the country's chips, which are being produced at its plants, are now reaching customers in the country and the world. Pitching India as a trusted alternative for global manufacturing, he said the country was "taking every step needed to become a preferred destination for the semiconductor industry".

India's semiconductor programme is now from approval and building to commercial production. Today 5 out of 12 projects that have been approved under the India Semiconductor Mission (ISM) 1.0 have started manufacturing chips or packaged semiconductor products, while the remaining 7 projects are under various stages of construction and development. All five producing units are packaging plants, while the programme's three fabs, where the chips are manufactured, will begin production sometime between 2027 and 2029.

Modi virtually opened the commercial production in Suchi Semicon's plant in Surat, Gujarat, and CDIL's plant in Mohali, Punjab at the event.

These 12 projects are expected to be funded with over ₹1.64 lakh crore, from 2023 to 2026. The government categorizes them as one silicon fab, one silicon-carbide fab, one integrated gallium-nitride (GaN) Micro-LED fab and nine packaging units.

Also Read: Sunil Gavaskar’s Message for Nitish Kumar Reddy and India’s Next-Gen All-Rounders: ‘Don’t Rush Them In’

What are the level of the Indian chips?

Fab is a place where circuits are cut into the silicon wafer at a particular node. The smaller the number the closer the transistors are placed on the chip and the more powerful the chip. The nanometre (nm) is a measure of manufacturing technology. The 2nm and 3nm process are the world's most advanced ones and Apple uses 2nm for their newest iPhones as examples.

The Indian chip making is at much larger nodes. The state-owned Semi-Conductor Laboratory (SCL) at Mohali with a production line of 180nm and later the state is upgrading the lab for nodes from 28nm to 180nm, which is the only facility in the country capable of handling the entire chip-making process from design to testing. Nodes do not apply to packaging plants such as the five now in commercial production. The latest node in ISM 1.0 pipeline is 28nm and is being built at the Tata-PSMC fab in Dholera, which will be the most advanced chip manufacturing plant in India when it begins production.

The government has announced it will proceed with the use of "mature nodes", which provide chips for cars, power systems, industrial equipment and consumer electronics; and will use those to develop plants, suppliers and a trained workforce before advancing to more advanced manufacturing and research.

The second mission—ISM 2.0—is intended to make that move. It is on track to the 3nm and 2nm nodes, and will accommodate 50 or more fabless companies that design chips and outsource the manufacturing.

The Tata-PSMC is the first large silicon manufacturing plant in India.The Tata-PSMC is India's first big silicon chip plant.

The biggest project, and the sole silicon fab, is the Tata Electronics project in Dholera, Gujarat, being being built in partnership with Taiwan's Powerchip Semiconductor Manufacturing Corporation (PSMC) and is valued at ₹91,526-crore. The fab will be capable of producing 50,000 300mm wafers per month and is planned to be capable of producing chips at 28nm, 40nm, 55nm, and 110nm nodes.

The most advanced node that's been publicized for the project is 28nm, a mature process, which is several generations older than the 3nm and 2nm processes used for the most advanced chips, but chips made at these nodes are used in cars, industrial equipment, power-management systems, connectivity devices and consumer electronics.

The government and company press releases earlier announced the fab's launch by the end of 2026, while as per the latest project reporting, commercial production is expected around 2028. The Dholera fab and the company's packaging plant in Assam were progressing in a timeline, Tata Electronics CEO and managing director Randhir Thakur said at the Semicon event on Thursday.

SiC materials and devices: silicon carbide materials and devices for power applications

SiCSem is a project in Bhubaneswar, Odisha, valued at ₹2,066-crore, which will become the first commercial silicon-carbide fab in the country. Silicon carbide is a compound semiconductor material, which is capable of bearing high voltage and high temperature, and which can be used for power electronics. The plant, operating under UK-based Clas-SiC Wafer Fab, will be able to process up to 60,000 wafers per year and package some 96 million units per year. It is designed to power EVs, fast chargers, solar inverters, railways, defence and data-centre power systems.

Planned for production in 2027-28.

Another specialised fab, an integrated gallium-nitride compound-semiconductor fabrication facility (CSEFF) with assembly, testing, marking and packaging (ATMP) unit, is being set up at Dholera by Crystal Matrix, which was approved in May 2026. It will provide GaN foundry services to manufacture chips based on other companies' designs and epitaxy, a technology that allows thin crystal layers to be grown, on six-inch wafers.

The plant will make Mini- and Micro-LED display modules for large commercial displays, TVs, smartphones, vehicle displays, extended-reality (XR) glasses and smartwatches. Planned capacity is 72,000 square metres of Mini/Micro-LED display panels and 24,000 sets of RGB GaN epitaxy wafers a year. The project is currently in the development phase and should start production around 2029.

All nine projects, other than the one described above, are semiconductor assembly and test (ATMP) or outsourced semiconductor assembly and test (OSAT) facilities. They assemble, package and test “die” chips that are cut from finished wafers elsewhere.

Micron's Sanand facility

On February 28, 2026, Micron's facility in Sanand, Gujarat, started commercial production. It mounts and tests DRAM and NAND chips, which are utilized to add working memory and storage to a device, respectively, in wafers that are produced in Micron's worldwide manufacturing network.

Micron is anticipating the production of tens of millions of chips in 2026, and hundreds of millions in 2027.

Also Read: 32-Year-Old Indian Woman Dies Suddenly in Sharjah While on Break From Work

Micron's Sanand facility

Micron's Sanand, Gujarat facility has started commercial production on February 28, 2026. It not only assembles and tests devices using DRAM and NAND chips, which are used for working memory and storage respectively in a device, but also creates the wafers using Micron's worldwide manufacturing network.

Micron is projecting a 2026 production of tens of millions of chips, and a hundredfold increase to hundreds of millions in 2027.

It is located in Sanand, Gujarat.It is situated at Kaynes Semicon's Sanand plant in Gujarat. Kaynes Semicon's manufacturing plant is scheduled to turn on on March 31, 2026. Its first products are intelligent power modules (IPMs) that integrate semiconductor devices for power-management applications. The plant will be capable of producing over 6.33 million chips per day and will cater to the domestic and international market.

CG Semi's Smart Factory and Storage Division.8. CG Semi's Storage Division. In July 2026, the company's plant in Sanand, Gujarat, inaugurated by Modi, started commercial production in a joint venture between CG Power, Renesas of Japan and Thailand's Stars Microelectronics.

The plant is capable of producing up to 300 million semiconductors annually, for automotive, industrial, consumer, power and communications applications.

Tata Semiconductor Assembly and Test (TSAT) Tata is constructing a ₹27,120-crore plant in Morigaon, Assam, that will have a capacity of 48 million units/day. It will employ cutting-edge packaging technologies, such as flip chip, where a die is placed face down and connected to its package with small metal bumps, and integrated system-in-package (ISIP), where multiple chips are packaged together.

It is designed to be used in automotive, EV, telecom and consumer applications. It is still in development and will be produced in the near future.

HCL-Foxconn's Jewar project

HCL-Foxconn's plant in Jewar, Uttar Pradesh, will make display-driver integrated circuits (DDICs), the chips that control the pixels on a screen, using gold-bump technology. It will be able to produce 20,000 wafers per month, equivalent to 36 million chips per month, of mobile phones, laptops, PCs, automobiles and other displays.

The project was ground broken in February 2026, and is scheduled to begin production in 2027.

The third project that 3D Glass Solutions is undertaking is in India (Odisha).

US based 3D Glass Solutions is developing the second ISM project in Odisha in the advanced packaging field, with SiCSem. Within a year, it will manufacture 69,600 glass panels and 50 million units it assembles as well as 13,200 3D heterogeneous integration (3DHI) modules. The 3DHI is a packaging that combines or stacks different types of chips. The project will generate over 2500 direct and indirect employment opportunities.

The technologies it targets are in the areas of AI, high-performance computing, 5G/6G, automotive radar, defence, and aerospace & photonics.

The commercial production is expected by August 2028 and the full scale volume production is expected by August 2030.

CDIL Mohali

Continental Device India Ltd (CDIL) has announced to expand its existing semiconductor business with the development and production of high power discrete devices such as MOSFETs, IGBTs, Schottky diodes and other transistors in silicon (Si) and silicon carbide (SiC). An integrated circuit contains many discrete devices on a single chip, while a discrete device only performs one function.

These are power semiconductors and therefore don't belong with the digital logic nodes of processors. Use cases: EVs, charging infrastructure, renewable energy, industrial systems and telecom.

The plant has started commercial production on Thursday under the leadership of the ISM.

Elite Sports India's project in Andhra Pradesh ASIP Technologies is establishing an OSAT plant in Andhra Pradesh with APACT, South Korea, with an annual capacity of 96 million units of chips for mobile phones, set-top boxes and appliances and automotive electronics. The project is under development.

Suchi Semicon's Surat plant

The approved OSAT unit from Suchi Semicon for discrete semiconductors will have an annual capacity of 1.033 billion chips. It is intended to be used in power electronics, analogue ICs, industrial automation, automotive and consumer electronics.

It started commercial production on Thursday.

The first phase of India's semiconductor programme is now from the approvals and construction stage to commercial production.

Also Read: SBI CISO Recruitment 2026: Apply for Chief Information Security Officer Post, CTC Up to ₹2.50 Crore